In this issue of Inside: HUAWEI Mate 40 body was shown in a real shot; new iPhone SE may get Touch ID again; the expected date of presentation of the flagship processor MediaTek Dimensity 2000 was announced; the characteristics of Vivo S7 were lit up on promotional teasers.
HUAWEI Mate 40 case shown in a real shot
While HUAWEI continues to work on the flagship Mate 40, insiders managed to get a photo of the device’s body. Judging by the data provided by the authoritative network informant Rodent950, the gadget will be equipped with a display with a diagonal of 6.7-6.8 inches. For comparison, the current Mate 30 Pro has a 6.53-inch screen.
Judging by the published photo, the novelty will be equipped with a sub-screen fingerprint scanner and an unusual-shaped camera module. A characteristic feature of the flagship will be a display rounded on the side edges. The Mate 40 based on the Kirin 1000/1020 processor is expected to be presented in September.
The smartphone is credited with an advanced main camera with a periscope module, 5x optical zoom, and a resolution of the main sensor of 50 megapixels. The device is also rumored to be equipped with fast power charging technology and 40-watt wireless.
New iPhone SE may get Touch ID again
Twitter insider Omegaleaks has released information on Apple’s plans to unveil a smartphone next year that will once again receive a Touch ID fingerprint scanner. In this case, according to the source, it will be integrated into the power key.
According to industry analyst Min-Chi Kuo, such changes may affect the iPhone SE 2 Plus model, which will be positioned as a budget model in the Cupertino-based vendor’s branded product line. It is indicated that the new product will receive a 6.1-inch display and an Apple A13 processor. The exact timing of the announcement and other characteristics of the device are unknown.
The expected date of presentation of the flagship processor MediaTek Dimensity 2000 has been announced
Several online sources pointed to MediaTek’s plans to present a serious competitor for the flagship line of Qualcomm processors. According to the current leak, the rival of the Snapdragon 875 will be a proprietary chip called Density 2000. Presumably, a mobile platform manufactured using a 5-nanometer process technology will be announced in spring 2021.
The delay, according to the source, is caused by MediaTek’s active development of two other chips: Density 620 and Density 420, which will also receive support for fifth-generation 5G networks.
The characteristics of Vivo S7 lit up on promotional teasers
Less than three months ago, the vendor Vivo introduced the S6 smartphone and is already actively working on the release of its successor, the S7. According to informants, the gadget will be presented on August 3 in China. Moreover, the new product appeared on the website of a large retailer Suning, and at the same time, several photos of official posters dedicated to the device were seen on the network.
At the same time, the source does not provide the technical characteristics of the novelty. We only know that the smartphone will receive a 44-megapixel camera, as well as thin bezels around the display.